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☀️ 🇩🇪🇨🇭🇫🇷 EMEA 
🇮🇱 --- 🌑

23m: QBit Semiconductor acquires 60% stake in Singapore’s SinChip

38m: Sony Semiconductor Joins MIPI Alliance as Promoter Member

78m: Silicon photonics growth risks constrained by scale-up challenges

95m: Redesigned high-NA lithography optical system aims to revolutionize semiconductor chipmaking

97m: Real-Time Motion Processors Market Forecast to 2035: Growth Driven by Semiconductor Automation and Pharmaceutical Robotics - News and Statistics

97m: 3 Semiconductor Stocks to Buy Following the Recent Chip Sector Sell-Off

2h: Citric Acid Powder Market Growth to Accelerate by 2035 Amid Semiconductor Expansion - News and Statistics

2¼h: The Bank of Korea warns that bonuses in the semiconductor industry may increase inflationary pressures.

2½h: Further weakness for Philadelphia Semiconductor Index following a double top

3h: South Korea’s semiconductor boom complicates inflation outlook, warns central bank

3½h: World Permeation Grouting Compounds - Market Analysis, Forecast, Size, Trends and Insights

4½h: World Acrylic Silicone Hybrid Sealants - Market Analysis, Forecast, Size, Trends and Insights

4½h: Volatile Organic Compound Cartridges Market Forecast Points Higher Toward 2035, Driven by Semiconductor Fab Expansion

4¾h: VanEck Semiconductor ETF (Derivatives) Price | SMH Price Today, Live Chart, USD converter, Market Capitalization

4¾h: Robotics And Automation Stocks Poised To Ride The Physical AI Wave

5h: Yeast Nutrient Blend Market Growth Outlook to 2035: Bio-Ethanol and Semiconductor Cleaning Applications Accelerate Demand - News and Statistics

5½h: World Corrugated Stainless Hose - Market Analysis, Forecast, Size, Trends and Insights

5¾h: From shop class to semiconductor labs

5¾h: Resonac : Patent on Liquid Encapsulant for AI Semiconductor Packages Upheld- A Key Technology Supporting Performance Enhancement of 2.5D Semiconductor Packages with Growing Demand

6¼h: Panel-Level Packaging Emerges as New Battleground for Semiconductor Equipment Makers

6¼h: to Release LOFIC-Equipped CMOS Image Sensor for Mobile Applications with 100 dB Dynamic Range and Low Power Consumption|Information|Sony Semiconductor Solutions Group

6¾h: Tower Semiconductor (TSEM) Signs IQE Deal To Secure AI Photonics Supply And End IP Dispute

7h: Wall Street Highlights: S\u0026P 500, Nasdaq Slips as Semiconductor Stocks Take a Breather; SpaceX Extends Gains

7¼h: Japan manufacturers’ sentiment rises for second month on chip-driven demand: Reuters Poll

7½h: Amkor touts 10-year TSMC deal to build U.S. semiconductor packaging hub in Arizona

7½h: Lattice Semiconductor (LSCC) Stock Could Be 2.3% Undervalued After Zacks Upgrade

8¼h: A Look at Alpha \u0026 Omega Semiconductor Ltd (AOSL) After 4.6% Decl

8½h: How AI Factories Are Creating New Winners Beyond Nvidia

8¾h: Samsung Life Insurance, SK Square Surge as Semiconductor Rally Beneficiaries

 Innatera hooks up with Cyran for AI-at-the-edge  - Innatera, the neuromorphic processor developer, and Cyran AI, a specialist in intelligent sensing and embedded AI, have expanded their collaboration aimed at accelerating the development of next-generation intelligent edge devices. The companies have already delivered an EMG-based application prototype....

 半導體風雲/美國製造回流 台供應鏈機會或糖衣毒藥?  - 隨著美國持續推動半導體製造回流政策,從《晶片法案》(CHIPS Act)補助到川普政府力推供應鏈在地化,外界普遍認為赴美投資已成為半導體供應鏈的必答題。然而,站在第一線供應鏈業者的角度來看,真正決定是否赴美設廠的關鍵,卻未必是補助金額,而是客戶是否願意提供長期訂單承諾與合理獲利空間。德鑫半導體聯盟總會長、家登集團董事長邱銘亁直言「即使美國政府願意提供補助,若沒有台積電、英特爾或其他晶圓廠客戶願意點頭,承諾未來訂單與價格支持,18家聯盟成員不會輕易赴美建立製造據點」。邱銘乾這段談話,道出目前台灣半導體供應鏈面對全球化與地緣政治重組下最真實的思維。...

 Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40%  - Intel's enhanced 18A-P has entered risk production, laying the groundwork to ramp the node into full production in the coming months.

 Danfoss Power Solutions to Establish Manufacturing Operations in Marcy, Creating up to 300 Jobs  - June 16, 2026 — UTICA, N.Y. — Danfoss Power Solutions, a global manufacturer of fluid conveyance and hydraulic systems, plans to establish new operations in Marcy, New York, bringing up to 300 new jobs to the Mohawk Valley by the end of 2027. Danfoss will move into the existing Computer Chip Commercialization...

 Japan\u2019s Strategic Position in the Semiconductor Industry in the AI Era  - Origianl Article By SemiVision Research [Reading time: 46 mins]

 Meta, Intel, Rivos, Poaching, Startups, And IP Transfers – What Is Going On?  - What happens when you have two companies, two startups, and what looks like a lot of backroom deals all come together? Read more ▶ The post Meta, Intel, Rivos, Poaching, Startups, And IP Transfers – What Is Going On? appeared first on Semiaccurate .

 RL Systems Mind the Gap: Matching Trainer and Generator Throughput  - RL Training Infrastructure, GRPO, PipelineRL, Async RL, Policy Staleness, RL Sandbox Infra, CPU Requirements, TCO Analys…

 'The retail SSD market has almost disappeared,' says Silicon Motion exec — PC OEMs are buying third-party drives as direct NAND supply dries up  - Vice president of client storage solutions at Silicon Motion warns that the retail SSD market has almost disappeared as NAND makers prioritize shipments of memory to AI data centers.

 Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

 TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package

 AMD’s massive SP7 socket for EPYC Venice and Intel’s gargantuan 9,324-pin socket for Diamond Rapids appear at Computex — SP7 and LGA9324-1 sockets will power the next generation of AI servers

 Intel's one-two punch plan in desktop CPUs is taking shape — Z990 spotted, Nova Lake detailed, ‘Raptor Lake Next’ teased

 Save 40% on this ultra-fast Samsung microSD card with 256GB storage, now just $47.99 — $32 saving on P9 Express model with read speeds of up to 800 MB/s, perfect for a gaming laptop or a Nintendo Switch 2

 AGI AI858 2TB SSD Review — High-end PCIe 5 speeds on a budget

 SMI's PCIe 6.0 SSD controller for consumer SSDs coming next year, but severe NAND shortages will get even worse in 2027 as AI data centers swallow supply — An interview with Silicon Motion's SVP Nelson Duann

 MSI MPG Coreliquid P22 360 Review: Low noise, strong performance, budget price

 Noctua finally releases its first AIO coolers — prices start at $220 for 240mm, features the company’s legendary A-series fans

 Intel's long-lost data center prototype 'Arctic Sound' Xe-HP multi-tile GPU surfaces in new engineering sample — Company's cancelled AI processor features 32GB of HBM2E

 Amazon UK has slashed 43% off this excellent 4K 32-inch OLED gaming monitor — lowest-ever price on this ASUS ROG Strix OLED now just £599

 Intel & SAP put HANA Cloud Platform at the center of a newly formed Co-Development  - By tightly aligning SAP software development with Intel’s hardware & software roadmap, new capabilities can be integrated earlier, bringing customer benefits to market faster than ever before.

 PREVAIL: A Unique European Testing Platform for Edge AI  - The European PREVAIL consortium has recently reached a major milestone with the commissioning of a state-of-the-art infrastructure designed to accelerate the development and prototyping of the next generation of Edge AI chips in Europe. Coordinated by CEA-Leti, the project brings together Europe’s four...

 Infineon Found to Infringe Innoscience Patents, Barred from Selling in China  - Innoscience announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon…

 Rapidus、伊Chips-IT財団と将来の半導体製造のための基本合意締結  - ~ 本政府とイタリアが進める技術協力の枠組みの一環として推進~

 [News] AMD Acquires MEXT to Address AI Memory Bottlenecks with Tech That Makes NAND Act Like DRAM  - AMD has acquired MEXT, a startup developing memory optimization technology aimed at easing data center memory bottlenecks. According to Tom’s Hardware, AMD announced on June 15 that it had acquired MEXT, whose memory tiering technology allows NAND flash to function as DRAM from the operating syste......

 Chips&Media’s Next-Generation Video CODEC IP Powers Ambarella’s Expanding Edge AI Portfolio  - Chips&Media has announced a strategic licensing agreement with Ambarella for its latest-generation video CODEC intellectual property (IP), marking a significant milestone in the evolution of edge AI, computer vision, and physical AI systems. The agreement follows an extensive technical evaluation process...

 AMD takes over MEXT to 'address growing memory constraints' in the data center — memory tiering technology enables flash to appear as DRAM to applications  - AMD acquires MEXT to get Predictive Memory Engine that offloads infrequently accessed data from DRAM to NAND storage.

 Don't Just Buy What is There  - The Nvidia journey from a Device Company to a Supply Chain Giant

 TP-Link MC220L: Media conversion keeps the network well  - Got lightning? A bidirectional RJ45/SFP intermediary can prevent it from propagating through the remainder of your network. The post TP-Link MC220L: Media conversion keeps the network well appeared first on EDN .

 CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI  - Breakthrough Reported at VLSI 2026 Also Extends to High-Performance Computing, Aerospace & Defense Systems, and IoT Platforms​

 This week’s outside five sigma (#103)  - Optical Circuit Switch with Lasers

🌔 Americas 
🇺🇸 --- ☀️

 Model your IPs and your NoCs  - Here is why abstraction levels matter and why the interconnect can’t be an afterthought in SoC design. The post Model your IPs and your NoCs appeared first on EDN .

 Poland turns to Taiwan to build up chips as Foxconn seals EV assembly deal  - Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains and technology capacity. The plan spans electric vehicles, semiconductors, and industrial policy, and reflects how governments are adapting to geopolitical pressure and...

 Omega-EVA signals China's push to bring world models into real-world robotics

 Exclusive: Largan taps Han's Laser equipment as optics makers target FAU growth

 PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors

 SpaceX to acquire Cursor in US$60 billion stock deal after blockbuster IPO

 India's PC market jumps in 1Q26 as notebook demand surges

 Nexchip reportedly broadens semiconductor ambitions with new design and materials subsidiary

 InnoScience wins GaN patent battle against Infineon in China

 China PCB maker DSBJ bets US$1.2 billion on AI optical modules

 Kaynes' Japan push signals India's bid to become an alternative chip packaging hub

 Shihlin Electric plans North America-focused plant as five business lines drive double-digit growth

 Alibaba moves Qwen AI into robotics with first embodied intelligence suite

 Ta Tun Electric Wire and Cable opens Arizona office to target US chip and AI demand

 China's six-network plan signals a long-term infrastructure and technology self-reliance push

 Huawei raises end-consumer product prices from July

 China cuts AI compute prices, revealing pressure to fill supercomputing capacity

 AI PC design wins, drone business to boost Elan in 2H26

 Acer E-Enabling posts nearly 20% revenue growth as AI agent demand boosts cloud and security services

 Samsung Electro-Mechanics expands silicon capacitor push on integration edge

 Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

 Gem Terminal eyes new growth curve in 2026 with shipments of AI-related thermal materials

 Amkor alone cheers 10-year TSMC packaging deal in Arizona

 Hiwin unit Matrix Precision deepens Japan cooperation as demand for high-precision gears rises

 Tata Electronics pollution probe closure highlights lingering risks for Apple's India supply chain

 PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth

 Superior Plating Technology turns to AI liquid cooling and CPO

 EssilorLuxottica, Applied Materials team up on smart eyewear technology

 Ajinomoto's chip film faces supply test as AI demand climbs

 Nvidia highlights role of optical networking as Coherent breaks ground on Texas AI chip facility

 EE Times Magazine – June 2026  - The June 2026 edition of EE Times Magazine explores autonomous aerospace and defense systems—from orbital data centers to AI-enabled drones. The post EE Times Magazine – June 2026 appeared first on EE Times .

 AMD's Mext buy shows how AI could solve the RAM shortage it created  - Running low on memory, can't afford more? The House of Zen's latest acquisition puts an AI spin on flash-based memory expansion

 VLSI 2026: Intel 18A Platform Momentum from Devices to Routed Designs  - At VLSI 2026, Intel Foundry highlighted how CPU cores built with backside power delivery show dramatically lower voltage droop, with the technology now transitioning into product adoption alongside st...

 Enkris unveils high-speed, low-power micro-LED optical interconnect product  - 8–12-inch GaN-on-Si micro-LED light-source products achieve 3dB bandwidth of 1.6GHz at 500A/cm 2 current density

 Samsung K4VOF165ZC D1b 12 Gb GDDR7 DRAM Memory Floorplan Analysis  - Discover Samsung's K4VOF165ZC D1b 12 Gb GDDR7 DRAM architecture with TechInsights' Memory Floorplan Analysis, featuring process technology, floorplan, critical dimensions, and cost analysis.

 FADU Extends eSSD Controller Contract Deadlines Again  - FADU's enterprise solid-state drive (eSSD) controller supply contracts are seeing repeated extensions, with the combined contract value reaching approximately 70 billion won.On May 6, FADU disclosed a contract to supply eSSD controllers to an overseas NAND flash memory manufacturer. The contract was

 Skyworks Si829x drives EV traction inverters  - Skyworks, the analog and mixed-signal specialist, is releasing its Si829x isolated safety gate driver for electric vehicle (EV) traction inverters and other electrified systems. Meeting ISO 26262 functional safety standards, the Si829x is suitable for use in functional safety systems rated up to ASIL...

 48,000+ Engineers and leaders read the eeNews Europe newsletter — join them  - In the electronics industry, innovation moves quickly and market dynamics change daily. Staying informed is essential. That’s why more than…

 FDA Approval of Glucose Monitor Explodes New Over-the-Counter Market  - A metabolic crisis is quietly sweeping through American youths, transforming paediatric prediabetes into one of the country's most urgent health emergencies. Recognising the acute need for accessible intervention, the U.S. Food and Drug Administration (FDA) achieved a historic milestone by expanding the...

 Semiconductor Startup Builds Alternatives for Vital Legacy Chips  - Phoenix targets the high-mix, low-volume demand for obsolete chips in critical systems

 半導體風雲/AI晶片戰隱形冠軍 高階材料掀地緣新賽局  - 台積電 前召開股東會,股東高度關注美國、 本及歐洲廠區營運現況與成本結構,管理階層也多次強調全球布局的重要性。對上游材料業者而言,過去只要滿足台灣單一生產基地需求,如今則必須思考如何同步支援北美、 本甚至歐洲客戶需求,供應模式已出現改變。...

 [News] TSMC Reportedly Runs Dual-Track Evaluation on CoPoS Pilot Line, Sparking Global, Local Vendor Competition  - TSMC Chairman C.C.Wei, as reported by the Economic Daily News, reaffirmed at the shareholders’ meeting in early June that a CoPoS (Chip-on-Panel-on-Substrate) pilot line is already in place, with mass production expected in 2–3 years—keeping the company’s panel-level packaging push in focus.......

 GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up  - GlobalFoundries leads with the first silicon to support OCI MSA, shaking up AI data centers. The post GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up appeared first on EE Times .

 IQE and Tower announce multi-year InP epiwafer supply agreement  - Porous silicon patent litigation resolved by Tower providing worldwide, royalty-free license to IQE

 Florida Semiconductor Institute and Ecotek Lab Inspire Future Innovators Through Hands-On Semiconductor STEM Camp  - The Florida Semiconductor Institute and Ecotek Lab hosted a three-day Semiconductor STEM Camp at NeoCity from June 9-11, providing middle and high school students with hands-on exposure to one of the nation’s fastest-growing industries.

 Rapidus signs MoU with UKSC  - Rapidus, the Japanese initiative targetting 2nm process technology, has signed an MoU with the UK Semiconductor Centre (UKSC) covering future semiconductor manufacturing. In January 2026, the leaders of Japan and the UK agreed to strengthen cooperation in the technology sector. Building on this, Japan...

 How AI forms the future of Europe’s EDA industry  - The User2User event hosted by Siemens EDA brings together the electronic design automation community to share their real-world experiences.

 The ‘rice of electronics’: how AI-driven demand for MLCCs triggered a supply bottleneck  - Power-hungry data centres fuel demand for MLCCs, which are crucial components for modern innovations including smartphones and electric cars

🌑 AsiaPac 
🇰🇷🇦🇺 --- ☀️ +

 Broadcom pushes 50G PON and Wi-Fi 8 for AI-driven home networks  - Broadcom has expanded its broadband portfolio with a 50G passive optical network (PON) system-on-chip and additional Wi-Fi 8…

 Designing Chips That Can Explain Themselves  - On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design intent and silicon behavior. The post Designing Chips That Can Explain Themselves appeared first on Semiconductor Engineering .

 Mitsubishi Electric Group Revises Environmental Sustainability Vision 2050 and Introduces Environmental Plan 2030  - Strengthening group-wide initiatives to address worsening global environmental challenges

 [News] TSMC, Amkor Sign 10-Year Arizona Advanced Packaging Pact to Complete the U.S. Chip Supply Chain  - TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties have announced a 10-year agreement to enhance advanced packaging capabilities in Arizona and support further investment in the U.S. semi......

 Intel Foundry Details Process Milestones and Future Innovation at VLSI Symposium  - Intel 18 A-P now in risk production with higher performance, enhanced thermal characteristics and design rule compatibility with Intel 18A

 Google Details Five Generations Of TPU Training Supercomputers  - Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training Supercomputers from TPU v2 to Ironwood: Architectural Stability, Scale, Resilience, Power Efficiency, and Sustainability Across Five Generations.” The paper summarizes five generations...

 Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026  - At the 2026 VLSI Symposium , Intel Foundry provided a detailed update on its process technology roadmap, highlighting the continued maturation of Intel 18A, the introduction of Intel 18A-P, and several advanced research initiatives that extend beyond current gate-all-around (GAA) transistor architectures....

 E Ink Showcases the Future of Sustainable Large-Format Color Signage at InfoComm 2026  - Company Highlights E Ink Marquee™, E Ink Spectra™ 6, E Ink Kaleido™ 3 and E Ink Prism™ 3 Technologies Across DOOH & Retail Media Signage and Design Applications

 Metasurface plus photoelectric quantum effect yields sensitive THz detector  - A new twist on a revolutionary physics principle leads to an innovative sensor that merges metasurface with quantum physics effect. The post Metasurface plus photoelectric quantum effect yields sensitive THz detector appeared first on EDN .

 SiMa Launches Agentic Development Environment for Physical AI  - Edge AI chip company said it can speed up engineer productivity when transferring to its hardware from months to hours. The post SiMa Launches Agentic Development Environment for Physical AI appeared first on EE Times .

 Coherent Announces a CHIPS Letter of Intent for $50 Million to Expand World-Leading Manufacturing Facility for AI Infrastructure  - Proposed award will support new manufacturing jobs and expanded American production of critical optical networking technologies that power next-generation AI datacenters

 Qualcomm said to be circling AI chip biz Tenstorrent in $10B RISC-V power play  - Potential takeover would represent significant commitment to the open instruction set architecture

 Nexperia stays profitable despite China disruption  - Nexperia reported a first-quarter 2026 revenue of 300.3 million dollars while remaining profitable despite losing control over its Chinese operations.

 A tower-like heterogeneous packaging architecture for the AI era  - For years, advanced packaging has been described mostly in planar terms: chiplets placed side by side, connected through interposers, bridges, redistribution layers, substrates, and short-reach electrical links. This view remains important. It supports today’s GPU, HBM, chiplet, and 2.5D integration...

 PicoJool introduces 200G VCSELs for scale-up AI data centers  - Sampling in Q3/2026 precedes high-volume ramp expected in early 2027 via foundry WIN

 Chip Industry Technical Paper Roundup: June 16  - Multi-GPU traffic modeling; physical neural computing; RISC-V fault injection; automotive CAN timing analysis; EUV source optimization; lithography defect detection; dual-beam EUV efficiency. The post Chip Industry Technical Paper Roundup: June 16 appeared first on Semiconductor Engineering .

 Contract Prices Surged More Than 100% in 1H26; Structural Shortages to Keep NOR Flash and SLC NAND Prices Rising in 2H26, Says TrendForce  - Major memory suppliers continue to prioritize capacity allocation toward higher-value products such as HBM and advanced-layer 3D NAND, according to TrendForce’s latest research on the memory industry. This has squeezed the mature-node capacity for NOR Flash and SLC NAND.

 Celonis and deepset launch sovereign AI platform for critical operations  - German software companies Celonis and deepset have teamed up to develop a sovereign AI platform aimed at…

 Rapidus signs UK chip pact in push for 2nm customers  - Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according...

 AMD to acquire MEXT to expand AI memory optimization tools

 Apple's Siri AI push drives 12GB DRAM demand for Samsung and SK Hynix

 TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

 Walrus Pump sees stronger liquid cooling demand, eyes higher 2026 growth

 Huawei's PanguLM comeback hinges on Richard Yu after credibility hit

 ByteDance in talks for Iluvatar, Baidu Kunlunxin AI chips as Doubao demand grows

 Samsung reportedly deepens foundry ties with Elon Musk's companies as turnaround timeline pushes toward 2028

 South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors

 Kioxia surpasses Toyota, eyes M&A push in face of AI boom

 Nvidia reportedly tightens grip on AI inference market despite growing competition

 Commentary: AI memory boom turns WF6 squeeze into an opening for CXMT

 AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity

 Salesforce agrees to buy Fin in US$3.6 billion AI customer service deal

 Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

 TSMC PLP timeline faces skepticism from Taiwan industry sources

 Adani-Jabil partnership highlights India's push for domestic AI infrastructure

 AI chip race sends WF6 prices soaring after Japan supply shock

 Tata iPhone components plant faces pollution probe as India supply chain risks rise

 Foxconn and Schneider Electric strike strategic partnership to build next-generation data center reference architecture

 Yaskawa eyes physical AI boom with JPY25 billion capex

 Apple leans on Google Cloud and Nvidia GPUs in a pragmatic AI reset

 Interview: From language to motion— Japanese startup APTO builds the data backbone for physical AI

 SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead

 Modeling Multi-GPU Traffic For Distributed AI Workloads (UW Madison, AMD)  - Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled “Eidola: Modeling Multi-GPU Network Communication Traffic in Distributed AI Workloads.” Abstract: “As distributed AI workloads grow in scale, multi-GPU systems have become...

 Liquid cooling technology for semiconductor chips is 10 times more efficient than previous record  - AI data centers are power-hungry. Not only do artificial intelligence computations consume enormous amounts of electricity, but a significant amount of energy is also required to cool the semiconductor chips that heat up ...

 Nanoengineered wood sets new record for transformer insulation  - The world's power grid is straining under the surge in electricity demand from data centers, electric vehicles and renewable energy. And a century-old technology, the power transformer, must support this dramatic increase. ...

 Research Bits: June 15  - NAND in space; integrated photonic functions on silicon; light-emitting organic transistor with memory. The post Research Bits: June 15 appeared first on Semiconductor Engineering .

 Mask Contamination: The Big Operational Headache for EUV Lithography  - Pellicles lasting less than a day of exposures, masks getting dirty at unknown times and getting worn out by cleans

 Battery-Free Artificial Photosynthesis Turns Sunlight, Water, and CO2 Into Fuel  - A self-regulating artificial photosynthesis system makes solar fuel without batteries, offering a simpler and potentially cheaper path to clean energy storage. Researchers at Osaka Metropolitan University have created a new artificial photosynthesis system that can produce solar fuel more consistently...

 Chinese compound chip stocks surge after Supreme Court blocks Infineon in GaN patent case  - A decision by China’s Supreme People’s Court on Friday upheld a lower court’s injunction issued against the German company in May

 [News] TSMC CoWoS Supply-Demand Gap Reportedly Seen Narrowing from 20% to 10% by End-2026  - TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Daily News, institutional investors said that as TSMC and its partners aggressively build out new advanced packaging capacity, the CoWoS supply-dem......


 [EOT] @lithos_graphein2026-Jun-17 04:23:24